Semtech Advances Next-Gen AI Optical Interconnects for XPO
Semtech’s 200G/lane modulator driver and TIA ICs accelerate the industry’s transition to XPO for AI network infrastructure
Semtech Corporation , a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, announced its membership in the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA), an industry initiative to enable high-bandwidth optical interconnects for AI network infrastructure. As a technology partner to the MSA, Semtech brings a broad portfolio of 200G/lane modulator driver and transimpedance amplifier (TIA) integrated circuits designed to support XPO transceiver development and volume deployment.
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“AI requires datacom optics with the highest performance, speed and density, and the market is poised to rapidly shift to 200G/lane electrical solutions this year,” said Scott Wilkinson, lead analyst for optical components at Cignal AI. “As AI operators transition to these high-speed optics, demand will continue to rapidly expand from $9 billion at the start of the AI revolution in 2024 to an estimated $37 billion in 2026.”
“XPO represents an innovative and practical approach to addressing network density challenges while preserving the field-serviceability and configurability benefits of pluggable optics,” said Scott Schube, vice president of applications engineering and product definition at Semtech. “Semtech’s portfolio of high-performance modulator drivers and TIAs is designed to support the XPO ecosystem from early prototyping through volume deployment.”
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Semtech’s 200G/lane Optical IC Portfolio for XPO
Semtech provides a broad portfolio of high-performance linear modulator driver and TIA ICs with low power, ultra-low latency and high density designed to support XPO transceiver applications.
Semtech’s XPO product family includes:
- GN1834L and GN1834DL quad TIAs with 750mm channel pitch
- GN1838L and GN1838DL octal TIAs with 500mm channel pitch
- GN42T380 octal TIA with 375mm channel pitch
- TN1877 quad and TN1887 octal Mach-Zehnder Modulator (MZM) drivers with 625mm channel pitch
- GN42M380 octal MZM driver with 375mm channel pitch
Key capabilities of the family include:
- Multiple configurations for maximum module and PIC design flexibility
- High linearity for best link integrity
- On-chip equalization to seamlessly optimize performance over different electrical PCB and optical channels, and enable use of different optics
- Integrated telemetry features for rapid time-to-market and link analysis and tuning
- Ultra-low latency optimized for high-density AI network switch and fabric applications
- High integration enabling compact transceiver designs consistent with XPO form factor requirements.
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